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Apply These 6 Secret Techniques To Improve Shield Control Cable

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작성자 Clement 작성일 24-12-14 07:58 조회 4 댓글 0

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intrinsically-safe-control-cable.jpg If the shield is grounded at a couple of finish, then noise present may flow within the shield due to a difference in ground potential at the two ends of the cable. The inner shield can then be terminated at only one end, thus avoiding the bottom-loop coupling that may happen if grounded at both ends. For many coaxial and circular connectors, they can be screwed onto the chassis immediately. It's difficult to terminate shield to chassis correctly. From the attitude of RF interference only, the shield might be left floating. If the cable shield is connected to the circuit ground, then these rf currents will enter the tools and will cause interference. Connect different non-shield conductors (comparable to energy, sign, energy ground, signal ground) to the circuit, as wires or traces. Therefore, when terminating a twisted pair, shielded or unshielded, don't untwist the conductors any greater than necessary to make the termination. It is, subsequently, essential to ascertain a low-impedance connection between the chassis and the circuit ground within the I/O area of the board.



Therefore, the right solution to terminate the cable shield is to the equipment’s shielded enclosure, to not the circuit floor. Use a 360-degree termination to the enclosure, to not circuit floor. Use ferrite beads to connect the shield to the circuit floor. Two reasons to use a double- shielded cable are as follows: One is to extend the excessive-frequency shielding effectiveness; the opposite is when you have got both excessive-frequency and low- frequency signals in the identical cable. Within the context of USB, there are a lot of practical issues that pressure designers to devitate from the best resolution. Consider the case of a PCB, with an enter/output (I/O) cable, mounted inside a metallic enclosure as shown in Fig. 3-24. Because the circuit floor carries current and has a finite impedance, there shall be a voltage drop VG across it. On the connector, there shall be a current division between the cable and the PCB ground-to-chassis connection.



The interior circuit ground should be related to the chassis at a point as close to the situation that the cables terminate on the PCB as possible. However, bonding circuit ground and chassis is often desirable because of different practical issues, primarily ESD. A major supply of radiation from digital products is due to widespread-mode currents on the exterior cables. The outer shield is usually also used to prevent radiation from the cable, which outcomes from high-frequency frequent-mode currents on the cable. Another flaw talked about by Williams, if I remember correctly, was the problem of frequent-mode radiation when the cable shield and power/sign ground isn't at the identical potential. This potential distinction, and due to this fact the shield current, is usually the result of 50/60-Hz currents in the ground. If the bottom aircraft is bonded to the chassis at the fitting aspect of the board, whereas the cable enters on the left side of the circuit board, this potential distinction would cause a common-mode noise current to circulate, degrading the EMI/EMC efficiency of the system. Establishing a low-impedance connection between the circuit floor and the chassis within the I/O space can be advantageous with respect to radio frequency (rf) immunity. AM and FM radio transmitters can induce excessive-frequency rf currents into the cable shield.



vab01.jpg This technique is usually simpler said than carried out, particularly when the frequencies involved might be within the range of lots of of megahertz or more. Many units have no metallic enclosure at all, invalidating your entire methodology. In my remark, the design of desktop computer motherboards largely displays the ideas behind this methodology. Using one other problem in PCB design for example: In PCB design, there is a rough consensus that, if the PCB is already partitioned into digital and analog sections, the return current in every section is usually contained in their own area. Thus, until very high isolation is required, splitting the analog and digital floor planes is usually counterproductive. Combined with some mixed-signal or analog circuits on the board which are weak to ground loop, the state of affairs turns into a total mess. Furthermore, USB connectors are tiny, especially the new Type C connectors, using gaskets or ground fingers is probably going not sensible. And indeed, many USB dongles are designed like that. Another flaw is that isolating the shield from the circuit ground is in a violation of the USB standard. Also, be aware that different connections between the chassis and the circuit boards are permitted. An unshielded twisted pair, unless its terminations are balanced (see Section 4.1), offers very little safety towards capacitive (electric field) pickup, however it's excellent for safety towards magnetic field pickup.

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